Front-End Processes

Partnering with you to deliver the latest in semiconductor front-end processes.

Play Video

While the pursuit of 5nm and 3nm technology nodes continue, many logic and memory manufacturers are taking things vertical to increase density for logic and memory. We’ll partner with you to simplify complex challenges.

Making the Impossible Possible

Manufacturing 3D transistors and 3D memory by stacking circuitry layers or cells requires unique know-how and magnified thinking. It also requires the right front-end process tools designed for precision and accuracy. Through intense collaboration, we can deliver sustainable solutions for high-performance, low-power devices.

Our team is ready to help

Related News

SkyWater Technology Foundry Selects Veeco’s WaferStorm for 3D Monolithic System-on-a-Chip Development

Read more

Renowned German Research Organization Selects Veeco’s Atomic Layer Deposition System to Drive Renewable Energy Innovation

Read more

Veeco CNT Ships 500th ALD System

Read more

Veeco Completes Acquisition of Ultratech

Read more

Silicon Semiconductor – Wet Beats Dry in 3D Backside Process Study

Read more

Chip Scale Review – Photoresist Strip Using Advanced Single-Wafer Process Technology

Read more

Veeco PSP White Paper: Wet Etch TSV Reveal Process More Cost Effective Than Dry Etch

Read more

Veeco | Gas Mixing Control and Reproducibility

Read more

Leading Taiwanese Semiconductor Foundry Selects Veeco’s Award Winning Gas Mixing System for High Volume Production

Read more

Veeco Completes Acquisition of Solid State Equipment Holdings LLC

Read more